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[供應(yīng)]Indium8.9HF1/88.25/SAC305/TYPE4
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- 更新日期：2025-07-30 15:30:07
- 有效期至：2026-07-30
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Indium8.9HF1/88.25/SAC305/TYPE4
詳細(xì)信息
Introduction
Indium8.9HF-1isanairreflow，no-cleansolderpaste.Indium8.9HF-1offersunprecedentedstencilprinttransferefficiencytoworkinthebroadestrangeofprocesses.Inaddition，thehighprobetestabilityofIndium8.9HF-1minimizesfalsefailuresinICT.
Alloys
IndiumCorporationmanufactureslow-oxidesphericalpowdercomposedofavarietyofPb-freealloysthatcoverabroadrangeofmeltingtemperatures.ThisdocumentcoversType4andType3powderasstandardofferingswithSACalloys.Themetalpercentistheweightpercentofthesolderpowderinthesolderpasteandisdependentuponthepowdertypeandapplication.Standardproductofferingsaredetailedinthefollowingtable.
Features
?HighoxidationbarriertoeliminategrapingandHIPdefects
?Highlyprobetestablefluxresidue
?Halogen-freeperEN14582testmethod
?Excellentprinttransferefficiencyon0.4mmpitchCSPs
CompatibleProducts
?ReworkFlux:TACFlux?089HF，TACFlux?020B
?CoredWire:CW-807
?WaveFlux:WF-9945，WF-9958
Note:Otherproductsmaybeapplicable.PleaseconsultoneofIndiumCorporation’sTechnicalSupportEngineers.
Cleaning
Indium8.9HF-1isdesignedforno-cleanapplications，howeverthefluxcanberemovedifnecessarybyusingacommerciallyavailablefluxresidueremover.
StencilCleaningisbestperformedusingisopropylalcohol(IPA)asasolvent.Mostcommerciallyavailablenon-water-basedstencilcleanersworkwell.
Printing
StencilDesign:
Electroformedandlasercut/electropolishedstencilsproducethebestprintingcharacteristicsamongstenciltypes.Stencilaperturedesignisacrucialstepinoptimizingtheprintprocess.Thefollowingareafewgeneralrecommendations:
?Discretecomponents—A10-20%reductionofstencilaperturehassignificantlyreducedoreliminatedtheoccurrenceofmid-chipsolderbeads.The“homeplate”designisacommonmethodforachievingthisreduction.
?Finepitchcomponents—Asurfaceareareductionisrecommendedforaperturesof20milpitchandfiner.Thisreductionwillhelpminimizesolderballingandbridgingthatcanleadtoelectricalshorts.Theamountofreductionnecessaryisprocessdependent(5-15%iscommon).
?Foroptimumtransferefficiencyandreleaseofthesolderpastefromthestencilapertures，industrystandardapertureandaspectratiosshouldbeadheredto.
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